Substrate : Max.100×100 glass, 4inch wafer
Tact time : 20~80min- Depends on the number of mask
Loading Capacity : Glass 1 sheet, Mask 4 sheet
Transfer Method : Vacuum Robot
Substrate rotation in process
Vacuum Performance : Deposition < 2E-7Torr
Plasma Treatment : Optional
Alignment accuracy : Mechanical, less than ±50um
Evaporation Source for organic(5ea) : 10cc for host, 4cc for dopant
Evaporation source for metal(2ea) : Thermal source, E-Beam is optional
Deposition uniformity : Organic, Metal, sputter less than ±3%
Max. deposition rate : organic 5A/sec, metal 10A/sec
Rate Accuracy : organic ±5%, Metal ±7%
Thickness reliability : Organic & Metal ±5% glass to glass
Doping ratio less than 1% at 1A/sec of host
Conductive Oxide : Low damage sputtering(FTS or general sputter)
Thin Film Passivation : Parylene coating & inorganic coating
Glove Box : H2O, O2 less than 0.1ppm
Fully automation System(Option)
註1:上記は例であり、客先の要求仕様に応じ、カスタムで設計します。
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